page 1 rev :a features common anode esd protection. iec61000-4-2 8kv(contact), 15kv(air). surface mount package. high component density . mechanical data case: sot -23 standard package, molded plastic. t erminals: gold plated, solderable per mil-std-750d, method 2026. marking code:e12 mounting position: any . w eight: 0.0078 gram(approx.). qw -jp020 comchip t echnology co., l td. cpdt -12v -hf smd esd protection diode s m d d i o d e s s p e c i a l i s t s y m b o l t y p p a r a m e t e r m i n m a x u n i t j u n c t i o n c a p a c i t a n c e c o n d i t i o n s d i o d e b r e a k d o w n v o l t a g e v b d v i r = 1 m a l e a k a g e c u r r e n t i l u a c t p f v r = 0 v , f = 1 m h z 1 3 0 . 1 1 7 1 2 2 . 0 v r = 1 2 v c l a m p i n g v o l t a g e e s d c a p a b i l i t y k v 1 6 peak pulse power p p p w 2 5 s t o r a g e t e m p e r a t u r e o p e r a t i o n t e m p e r a t u r e 1 2 5 c t s t g t j c 1 5 0 - 5 5 v c v i pp = 1a,t p =8/20us 25 t p =8/20us e s d iec 61000-4-2(air) iec 61000-4-2(contact) 8 d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 2 3 3 1 2 0.1 18(3.00) 0.1 10(2.80) 0.055(1.40) 0.047(1.20) 0.079(2.00) 0.071(1.80) 0.041(1.05) 0.035(0.90) 0.020(0.50) 0.012(0.30) 0.006(0.150) 0.003(0.080) 0.100(2.55) 0.089(2.25) 0.004(0.10) max 0.008(0.20) min maximum rating and electrical characteristics (at t a =25 c unless otherwise noted) r o h s d e v i c e
ra ting and characteristic cur ves (cpdt -12v -hf) smd esd protection diode s m d d i o d e s s p e c i a l i s t page 2 rev :a qw -jp020 comchip t echnology co., l td. r e v e r s e c u r r e n t ( a ) p o w e r r a t i n g ( % ) f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t w a v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 f i g . 2 - r e v e r s e c h a r a c t e r i s t i c s f ig . 4 - p o w e r r a ti n g d e r a ti n g c u r v e reverse voltage (%) ambient temperature ( c) t ime (us) i p p m 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 1 0 2 0 3 0 4 0 8 us to 100% 20 us to 50us 2 0 4 0 6 0 8 0 1 0 0 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 mounting on glass epoxy pcbs 0 2 0 4 0 6 0 1 0 0 1 0 0 n 1 u 1 0 u 1 0 n 8 0 c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) f i g . 3 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r i s t i c s r e v e r s e v o l t a g e ( v ) 0 4 8 1 2 1 6 0 8 1 6 4 1 2
i n d e x h o l e o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d e f b w a p p 0 p 1 d 1 d 2 d w 1 t c direction of feed reel t aping specification smd esd protection diode s m d d i o d e s s p e c i a l i s t page 3 rev :a qw -jp020 comchip t echnology co., l td. b c d d d 2 d 1 s o t - 2 3 s y m b o l a ( m m ) ( i n c h ) 2 . 1 4 2 0 . 0 1 6 4 . 0 0 0 . 1 0 1 . 5 0 + 0 . 1 0 5 4 . 4 0 0 . 4 0 1 3 . 0 0 0 . 2 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 1 7 8 1 . 0 0 0 . 0 5 9 0 . 0 0 4 + 7 . 0 0 8 0 . 0 3 9 0 . 5 1 2 0 . 0 0 8 s y m b o l ( m m ) ( i n c h ) 0 . 0 . 0 0 4 1 5 8 0 . 1 5 8 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 e f p p 0 p 1 w w 1 1 . 7 5 0 . 1 0 0 . 0 6 9 0 . 0 0 4 3 . 5 0 0 . 0 5 0 . 1 3 8 0 . 0 0 2 s o t - 2 3 3 . 1 5 0 . 1 0 0 . 1 2 4 0 . 0 0 4 2 . 7 7 0 . 1 0 0 . 1 0 9 0 . 0 0 4 1 . 2 2 0 . 1 0 0 . 0 4 8 0 . 0 0 4 9 . 5 0 1 . 0 0 0 . 3 7 4 0 . 0 3 9 8 . 0 0 0 . 3 0 / + C 0 . 1 0 0 . 3 1 5 0 . 0 1 2 / + C 0 . 0 0 4
part number cpdt -12v -hf marking code e12 marking code e12 3 1 2 smd esd protection diode s m d d i o d e s s p e c i a l i s t page 4 rev :a qw -jp020 comchip t echnology co., l td. suggested p ad layout a c b size (inch) 0.031 (mm) 0.80 1.90 2.02 0.075 0.080 sot -23 2.82 0.1 1 1 a b c d d standard package case t ype qty per reel (pcs) 3000 sot -23 reel size (inch) 7
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